DoITPoMS Home Search DoITPoMS Contact DoITPoMS
University of Cambridge Home  DoITPoMS Teaching and Learning Packages
DoITPoMS > TLP Library > Creep Deformation of Metals

Creep Deformation of Metals

Creep is a major concern in engineering, since it can cause materials to fail well below their yield stress. This package outlines the mechanisms of creep and the associated equations. It is largely based around a first year Materials Science practical at the University of Cambridge, which is concerned with the creep of solder at different temperatures. It also includes a case study of a creep-resistant material to illustrate how materials can be designed to prevent creep.

Photograph of coil undergoing creep

Photograph of coil undergoing creep
begin

First created: August 2006. Last updated: September 2006


Except where otherwise noted, content on this page is licensed under a Creative commons licence image for Attribution-Noncommercial-Share Alike Creative Commons Attribution-Noncommercial-Share Alike 2.0 UK: England & Wales Licence.