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Creep is a major concern in engineering, since it can cause materials to fail well below their yield stress. This package outlines the mechanisms of creep and the associated equations. It is largely based around a first year Materials Science practical at the University of Cambridge, which is concerned with the creep of solder at different temperatures. It also includes a case study of a creep-resistant material to illustrate how materials can be designed to prevent creep.

	Aims Before you start Introduction Creep mechanisms Effects of stress and temperature on creep rate Creep rate equation The creeping coil experiment - variable stresses in a single specimen Experimental set-up Evaluating the stress exponent Evaluating the activation energy Simulation of creeping coil Creep of other metals Summary Questions Going further
You can also view and download the animations from this TLP at CORE-Materials

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First created: August 2006. Last updated: September 2006