TLP Library
Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.
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- Currently showing
- 17 TLPs having the following tags:
This TLP builds upon the introduction to yield criteria covered in the Stress analysis and Mohr's circle TLP and introduces a range of methods commonly used to study metal forming processes.
It is common in basic analysis to treat bulk materials as isotropic - their properties are independent of the direction in which they are measured. However the atomic scale structure can result in properties that vary with direction. This teaching and learning package (TLP) looks into typical examples of such anisotropy and gives a brief mathematical look into modelling the behaviour.
This teaching and learning package provides an introduction to Brillouin zones in two and three dimensions and is aimed at developing familiarity with Brillouin Zones. It will not cover any specific applications. Brillouin Zones are particularly useful in understanding the electronic and thermal properties of crystalline solids.
This TLP introduces a number of important processes through which metallic items can be fabricated from molten metal. As well as detailing the practical aspects of these manufacturing processes, attention is given to the important parameters which determine the microstructure of the finished items.
Creep is a major concern in engineering, since it can cause materials to fail well below their yield stress. This package outlines the mechanisms of creep and the associated equations. It is largely based around a first year Materials Science practical at the University of Cambridge, which is concerned with the creep of solder at different temperatures. It also includes a case study of a creep-resistant material to illustrate how materials can be designed to prevent creep.
Crystalline materials are characterised by a regular atomic structure that repeats itself in all three dimensions. In other words the structure displays translational symmetry.
This teaching and learning package covers the fundamentals of metal forming processes.
An introduction to the mechanisms and driving forces of diffusion, and some of the processes in which it is observed.
Tags:
diffusion
fundamentals
Electromigration is an ever-increasing problem as integrated circuits are pushed towards further miniaturization. The theory of the phenomenon is explained, including electromigration-induced failure and how it has been and can be minimized.
This TLP provides an introduction to the deconstruction and investigation of the materials and processes used in an everyday item or article.
This teaching and learning package is an introduction to the basic concepts of polymer science. It includes molecular structure, synthesis and tests for identification.
The next time you drain a canned beverage or take a journey in a car, you might like to think about what will happen to it when it reaches the end of its useful life. This teaching and learning package will look at metals recycling from a materials science viewpoint – not simply outlining the need for recycling, but explaining the complex scientific principles behind some aspects of the recycling process itself.
Tags:
manufacturing
metals
This teaching and learning package (TLP) is an introduction to how solute affects the solidification of metallic alloys.
This TLP covers the use of the Stereographic projection and Wulff nets.
This teaching and learning package provides an introduction to the theory of metal forming. It discusses how stress and strain can be presented as tensors, and ways of identifying the principal stresses. Suitable yield criteria to treat metals and non-metals are also presented.
This TLP offers an introduction to the mathematics of tensors rather than the intricacies of their applications. Its aims are to familiarise the learner with tensor notation, how they can be constructed and how they can be manipulated to give numerical answers to problems.
Tags:
fundamentals
tensors
This teaching and learning package (TLP) is based on lab work in the Department of Materials Science and Metallurgy at the University of Cambridge. The TLP provides an introduction to the topic of thermal expansion, and its application, together with the different stiffness of materials, in the bi-material strip. The TLP leads you through experiments to measure Young's Modulus from the deflection of a cantilever beam, and to estimate the boiling temperature of nitrogen and the expansivity of a polycarbonate material from the curvature of a bi-material strip immersed in liquid nitrogen.

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