TLP Library
Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.
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- Currently showing
- 14 TLPs having the following tags:
Analysis of Deformation Processes
This TLP builds upon the introduction to yield criteria covered in the Stress analysis and Mohr's circle TLP and introduces a range of methods commonly used to study metal forming processes.
Introduction To Anisotropy
It is common in basic analysis to treat bulk materials as isotropic - their properties are independent of the direction in which they are measured. However the atomic scale structure can result in properties that vary with direction. This teaching and learning package (TLP) looks into typical examples of such anisotropy and gives a brief mathematical look into modelling the behaviour.
Casting
This TLP introduces a number of important processes through which metallic items can be fabricated from molten metal. As well as detailing the practical aspects of these manufacturing processes, attention is given to the important parameters which determine the microstructure of the finished items.
Creep Deformation of Metals
Creep is a major concern in engineering, since it can cause materials to fail well below their yield stress. This package outlines the mechanisms of creep and the associated equations. It is largely based around a first year Materials Science practical at the University of Cambridge, which is concerned with the creep of solder at different temperatures. It also includes a case study of a creep-resistant material to illustrate how materials can be designed to prevent creep.
Introduction To Deformation Processes
This teaching and learning package covers the fundamentals of metal forming processes.
Diffusion
An introduction to the mechanisms and driving forces of diffusion, and some of the processes in which it is observed.
Tags:
diffusion
fundamentals
Introduction To Dislocations
Dislocations are crucially important in determining the mechanical behaviour of materials. This teaching and learning package provides an introduction to dislocations and their motion through a crystal. A 'bubble raft' model is used to demonstrate some of the features of dislocations and other lattice defects. Some methods for observing real dislocations in materials are examined.
Electromigration
Electromigration is an ever-increasing problem as integrated circuits are pushed towards further miniaturization. The theory of the phenomenon is explained, including electromigration-induced failure and how it has been and can be minimized.
Introduction To Mechanical Testing
This teaching and learning package is based on laboratory experiments used in the Department of Materials Science and Metallurgy at the University of Cambridge. The package looks at how the microstructure of a material can affect its properties. It is split into two experiments: the first part introduces tensile testing and stress-strain curves, while the second part uses three-point bending, as introduced in the Beam Stiffness TLP.
The Nernst Equation and Pourbaix Diagrams
This teaching and learning package (TLP) investigates the Nernst equation and Pourbaix diagrams, which are both important parts of electrochemistry and corrosion science.
Slip in Single Crystals
This teaching and learning package explains how plastic deformation of materials occurs through the mechanism of slip. Slip involves dislocation glide on particular slip planes. The geometry of slip is explained, and electron microscopy techniques are used to show slip occurring in single crystals of cadmium.
Solidification of Alloys
This teaching and learning package (TLP) is an introduction to how solute affects the solidification of metallic alloys.
Stress Analysis and Mohr's Circle
This teaching and learning package provides an introduction to the theory of metal forming. It discusses how stress and strain can be presented as tensors, and ways of identifying the principal stresses. Suitable yield criteria to treat metals and non-metals are also presented.
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