Dissemination of IT for the Promotion of Materials Science (DoITPoMS)

DoITPoMS TLP Library

TLP Library

Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.

TLPs containing HTML5 animations/simulations are labelled with the tag . We have found that often the HTML5 animations render better in Microsoft Edge, so if your favourite browser does not work very well with them, please try an alternative.

Additive Manufacturing

This TLP provides an introduction to additive manufacturing methods, their advantages and limitations, and how the properties of printed objects are affected by varying printing parameters.

Introduction To Anisotropy

It is common in basic analysis to treat bulk materials as isotropic - their properties are independent of the direction in which they are measured. However the atomic scale structure can result in properties that vary with direction. This teaching and learning package (TLP) looks into typical examples of such anisotropy and gives a brief mathematical look into modelling the behaviour.

Casting

This TLP introduces a number of important processes through which metallic items can be fabricated from molten metal. As well as detailing the practical aspects of these manufacturing processes, attention is given to the important parameters which determine the microstructure of the finished items.

Coating Mechanics

This TLP should provide some insights into the mechanics of bi-layer (coating on substrate) systems. It covers the concept of a misfit strain and the way in which equilibrium is established after its introduction, including the creation of curvature. The differences between "thin" and "thick" coating cases are explained.

Creep Deformation of Metals

Creep is a major concern, since it can cause materials to progressively deform, and possibly to fail, under applied stresses below their yield stress. This is particularly likely at elevated temperatures. In this package, the main mechanisms of creep are outlined and some analytical expressions presented that are used to represent its progression. Testing procedures are described, covering both simple uniaxial loading and more complex test geometries. It is shown how creep characteristics can be inferred from the outcome of such tests, requiring in some cases numerical (finite element) modelling of the process. Information is also presented about the design of highly creep-resistant materials.

Introduction To Deformation Processes

This teaching and learning package covers the fundamentals of metal forming processes.

Diffusion

An introduction to the mechanisms and driving forces of diffusion, and some of the processes in which it is observed.

Electromigration

Electromigration is an ever-increasing problem as integrated circuits are pushed towards further miniaturization. The theory of the phenomenon is explained, including electromigration-induced failure and how it has been and can be minimized.

Epitaxial Growth

This TLP enables you to explore the way in which perfect thin crystalline layers are deposited epitaxially (i.e. in the same crystal orientation) on semiconductor substrates. This is the way many electronic and opto-electronic devices are now fabricated using techniques such as molecular beam epitaxy (MBE).

Examination of a Manufactured Article

This TLP provides an introduction to the deconstruction and investigation of the materials and processes used in an everyday item or article.

Physical Vapour Deposition of Thin Films

This TLP aims to look at Physical Vapour Deposition (PVD) as a method to apply thin films. It covers evaporation and sputtering, and then moves on to look at shadowing.

Powder processing

This teaching and learning package (TLP) provides an introduction to the dynamics of powder particles in fluid streams and relates this background to issues such as the time for which such particles remain suspended in air or water and the likelihood of them striking obstacles in their path. It also presents a description of the main routes by which (ceramic or metallic) powders are converted to solid objects.

Recycling of Metals

The next time you drain a canned beverage or take a journey in a car, you might like to think about what will happen to it when it reaches the end of its useful life. This teaching and learning package will look at metals recycling from a materials science viewpoint - not simply outlining the need for recycling, but explaining the complex scientific principles behind some aspects of the recycling process itself.

Solidification of Alloys

This teaching and learning package (TLP) is an introduction to how solute affects the solidification of metallic alloys.