Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.
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It is common in basic analysis to treat bulk materials as isotropic - their properties are independent of the direction in which they are measured. However the atomic scale structure can result in properties that vary with direction. This teaching and learning package (TLP) looks into typical examples of such anisotropy and gives a brief mathematical look into modelling the behaviour.
This TLP introduces a number of important processes through which metallic items can be fabricated from molten metal. As well as detailing the practical aspects of these manufacturing processes, attention is given to the important parameters which determine the microstructure of the finished items.
This TLP should provide some insights into the mechanics of bi-layer (coating on substrate) systems. It covers the concept of a misfit strain and the way in which equilibrium is established after its introduction, including the creation of curvature. The differences between "thin" and "thick" coating cases are explained.
Creep is a major concern, since it can cause materials to progressively deform, and possibly to fail, under applied stresses below their yield stress. This is particularly likely at elevated temperatures. In this package, the main mechanisms of creep are outlined and some analytical expressions presented that are used to represent its progression. Testing procedures are described, covering both simple uniaxial loading and more complex test geometries. It is shown how creep characteristics can be inferred from the outcome of such tests, requiring in some cases numerical (finite element) modelling of the process. Information is also presented about the design of highly creep-resistant materials.
An introduction to the mechanisms and driving forces of diffusion, and some of the processes in which it is observed.
Electromigration is an ever-increasing problem as integrated circuits are pushed towards further miniaturization. The theory of the phenomenon is explained, including electromigration-induced failure and how it has been and can be minimized.
This TLP enables you to explore the way in which perfect thin crystalline layers are deposited epitaxially (i.e. in the same crystal orientation) on semiconductor substrates. This is the way many electronic and opto-electronic devices are now fabricated using techniques such as molecular beam epitaxy (MBE).
This TLP aims to look at Physical Vapour Deposition (PVD) as a method to apply thin films. It covers evaporation and sputtering, and then moves on to look at shadowing.
This teaching and learning package (TLP) is an introduction to how solute affects the solidification of metallic alloys.