Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.
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- atomic-scale structure(19)
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It is common in basic analysis to treat bulk materials as isotropic - their properties are independent of the direction in which they are measured. However the atomic scale structure can result in properties that vary with direction. This teaching and learning package (TLP) looks into typical examples of such anisotropy and gives a brief mathematical look into modelling the behaviour.
This TLP introduces a number of important processes through which metallic items can be fabricated from molten metal. As well as detailing the practical aspects of these manufacturing processes, attention is given to the important parameters which determine the microstructure of the finished items.
Creep is a major concern, since it can cause materials to progressively deform, and possibly to fail, under applied stresses below their yield stress. This is particularly likely at elevated temperatures. In this package, the main mechanisms of creep are outlined and some analytical expressions presented that are used to represent its progression. Testing procedures are described, covering both simple uniaxial loading and more complex test geometries. It is shown how creep characteristics can be inferred from the outcome of such tests, requiring in some cases numerical (finite element) modelling of the process. Information is also presented about the design of highly creep-resistant materials.
An introduction to the mechanisms and driving forces of diffusion, and some of the processes in which it is observed.
Electromigration is an ever-increasing problem as integrated circuits are pushed towards further miniaturization. The theory of the phenomenon is explained, including electromigration-induced failure and how it has been and can be minimized.
Discusses the aims, method and use of results of a test for the hardenability of steel.
This teaching and learning package (TLP) looks at how what we see in micrographs relates to equilibrium phase diagrams and cooling routes for alloy systems.
This teaching and learning package (TLP) is an introduction to how solute affects the solidification of metallic alloys.