Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.
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- atomic-scale structure(19)
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Currently showing 13 TLPs
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This TLP builds upon the introduction to yield criteria covered in the Stress analysis and Mohr's circle TLP and introduces a range of methods commonly used to study metal forming processes.
This TLP should provide some insights into the mechanics of bi-layer (coating on substrate) systems. It covers the concept of a misfit strain and the way in which equilibrium is established after its introduction, including the creation of curvature. The differences between "thin" and "thick" coating cases are explained.
This teaching and learning package covers the fundamentals of metal forming processes.
This teaching and learning package (TLP) uses an atomistic model of the misfit energy to predict dislocation width and Peierls stress.
Dislocations are crucially important in determining the mechanical behaviour of materials. This teaching and learning package provides an introduction to dislocations and their motion through a crystal. A 'bubble raft' model is used to demonstrate some of the features of dislocations and other lattice defects. Some methods for observing real dislocations in materials are examined.
Electromigration is an ever-increasing problem as integrated circuits are pushed towards further miniaturization. The theory of the phenomenon is explained, including electromigration-induced failure and how it has been and can be minimized.
This TLP enables you to explore the way in which perfect thin crystalline layers are deposited epitaxially (i.e. in the same crystal orientation) on semiconductor substrates. This is the way many electronic and opto-electronic devices are now fabricated using techniques such as molecular beam epitaxy (MBE).
This teaching and learning package (TLP) introduces the basic mechanics involved in mechanical testing of metals, first outlining the meaning of deviatoric and hydrostatic stresses and strains, followed by definitions of true and nominal values and then covering the idea of constitutive laws that characterise the development of plastic deformation. The issues involved in carrying out conventional uniaxial (tensile and compressive) tests, and interpreting experimental outcomes, are then described. Finally, hardness testing is explained, followed by the development of a related technique involving indentation testing that allows full stress-strain curves to be obtained. All of the analyses are based on a continuum treatment of plastic deformation, with extensive numerical modelling, using the Finite Element Method (FEM).
This TLP should provide some insights into the plasticity of crystals. It covers some of the important concepts in single-crystals such as Frank-Read source, Lomer locks, climb and cross-slip, and their roles in forest hardening. In addition, grain boundary hardening in poly-crystals is also explained.
This TLP aims to look at Physical Vapour Deposition (PVD) as a method to apply thin films. It covers evaporation and sputtering, and then moves on to look at shadowing.
This teaching and learning package explains how plastic deformation of materials occurs through the mechanism of slip. Slip involves dislocation glide on particular slip planes. The geometry of slip is explained, and electron microscopy techniques are used to show slip occurring in single crystals of cadmium.
This teaching and learning package provides an introduction to the theory of metal forming. It discusses how stress and strain can be presented as tensors, and ways of identifying the principal stresses. Suitable yield criteria to treat metals and non-metals are also presented.
Consideration of the behaviour of surfaces in contact with one another leads to the subject of tribology ? the study of the friction, lubrication and wear of materials.