Dissemination of IT for the Promotion of Materials Science (DoITPoMS)

DoITPoMS TLP Library

TLP Library

Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.

TLPs containing HTML5 animations/simulations are labelled with the tag . We have found that often the HTML5 animations render better in Microsoft Edge, so if your favourite browser does not work very well with them, please try an alternative.

Analysis of Deformation Processes

This TLP builds upon the introduction to yield criteria covered in the Stress analysis and Mohr's circle TLP and introduces a range of methods commonly used to study metal forming processes.

Casting

This TLP introduces a number of important processes through which metallic items can be fabricated from molten metal. As well as detailing the practical aspects of these manufacturing processes, attention is given to the important parameters which determine the microstructure of the finished items.

Coating Mechanics

This TLP should provide some insights into the mechanics of bi-layer (coating on substrate) systems. It covers the concept of a misfit strain and the way in which equilibrium is established after its introduction, including the creation of curvature. The differences between "thin" and "thick" coating cases are explained.

Creep Deformation of Metals

Creep is a major concern, since it can cause materials to progressively deform, and possibly to fail, under applied stresses below their yield stress. This is particularly likely at elevated temperatures. In this package, the main mechanisms of creep are outlined and some analytical expressions presented that are used to represent its progression. Testing procedures are described, covering both simple uniaxial loading and more complex test geometries. It is shown how creep characteristics can be inferred from the outcome of such tests, requiring in some cases numerical (finite element) modelling of the process. Information is also presented about the design of highly creep-resistant materials.

Crystallographic Texture

This teaching and learning package (TLP) introduces the concept of texture in crystalline materials such as common metals and metallic alloys.

Microstructural Examination

This teaching and learning package (TLP) looks at how what we see in micrographs relates to equilibrium phase diagrams and cooling routes for alloy systems.

Phase Diagrams and Solidification

Phase diagrams are a useful tool in metallurgy and other branches of materials science. They show the mixture of phases present in thermodynamic equilibrium. This teaching and learning package looks at the theory behind phase diagrams, and ways of constructing them, before running through an experimental procedure, and presenting the results which can be obtained.

Solid Solutions

This teaching and learning package is based on a practical used within the Department of Materials Science and Metallurgy at the University of Cambridge. The package is aimed at first year undergraduate Materials Science students and focuses on the different types of solid solution and the thermodynamic principles involved in understanding them.

Solidification of Alloys

This teaching and learning package (TLP) is an introduction to how solute affects the solidification of metallic alloys.

Stress Analysis and Mohr's Circle

This teaching and learning package provides an introduction to the theory of metal forming. It discusses how stress and strain can be presented as tensors, and ways of identifying the principal stresses. Suitable yield criteria to treat metals and non-metals are also presented.

Superelasticity and Shape Memory Alloys

This teaching and learning package (TLP) introduces the phenomena of superelasticity and the shape memory effect.

Tensors in Materials Science

This TLP offers an introduction to the mathematics of tensors rather than the intricacies of their applications. Its aims are to familiarise the learner with tensor notation, how they can be constructed and how they can be manipulated to give numerical answers to problems.