Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.
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This TLP introduces a number of important processes through which metallic items can be fabricated from molten metal. As well as detailing the practical aspects of these manufacturing processes, attention is given to the important parameters which determine the microstructure of the finished items.
This TLP should provide some insights into the mechanics of bi-layer (coating on substrate) systems. It covers the concept of a misfit strain and the way in which equilibrium is established after its introduction, including the creation of curvature. The differences between "thin" and "thick" coating cases are explained.
Creep is a major concern, since it can cause materials to progressively deform, and possibly to fail, under applied stresses below their yield stress. This is particularly likely at elevated temperatures. In this package, the main mechanisms of creep are outlined and some analytical expressions presented that are used to represent its progression. Testing procedures are described, covering both simple uniaxial loading and more complex test geometries. It is shown how creep characteristics can be inferred from the outcome of such tests, requiring in some cases numerical (finite element) modelling of the process. Information is also presented about the design of highly creep-resistant materials.
This teaching and learning package (TLP) introduces the concept of texture in crystalline materials such as common metals and metallic alloys.
Electromigration is an ever-increasing problem as integrated circuits are pushed towards further miniaturization. The theory of the phenomenon is explained, including electromigration-induced failure and how it has been and can be minimized.
This TLP enables you to explore the way in which perfect thin crystalline layers are deposited epitaxially (i.e. in the same crystal orientation) on semiconductor substrates. This is the way many electronic and opto-electronic devices are now fabricated using techniques such as molecular beam epitaxy (MBE).
This teaching and learning package (TLP) looks at how what we see in micrographs relates to equilibrium phase diagrams and cooling routes for alloy systems.
Phase diagrams are a useful tool in metallurgy and other branches of materials science. They show the mixture of phases present in thermodynamic equilibrium. This teaching and learning package looks at the theory behind phase diagrams, and ways of constructing them, before running through an experimental procedure, and presenting the results which can be obtained.
This TLP aims to look at Physical Vapour Deposition (PVD) as a method to apply thin films. It covers evaporation and sputtering, and then moves on to look at shadowing.
This teaching and learning package is based on a practical used within the Department of Materials Science and Metallurgy at the University of Cambridge. The package is aimed at first year undergraduate Materials Science students and focuses on the different types of solid solution and the thermodynamic principles involved in understanding them.
This teaching and learning package (TLP) is an introduction to how solute affects the solidification of metallic alloys.
This teaching and learning package (TLP) introduces the phenomena of superelasticity and the shape memory effect.