Dissemination of IT for the Promotion of Materials Science (DoITPoMS)

DoITPoMS TLP Library

TLP Library

Teaching and learning packages (TLPs) are self-contained, interactive resources, each focusing on one area of Materials Science.

TLPs containing HTML5 animations/simulations are labelled with the tag . We have found that often the HTML5 animations render better in Microsoft Edge, so if your favourite browser does not work very well with them, please try an alternative.

Analysis of Deformation Processes

This TLP builds upon the introduction to yield criteria covered in the Stress analysis and Mohr's circle TLP and introduces a range of methods commonly used to study metal forming processes.

Introduction To Anisotropy

It is common in basic analysis to treat bulk materials as isotropic - their properties are independent of the direction in which they are measured. However the atomic scale structure can result in properties that vary with direction. This teaching and learning package (TLP) looks into typical examples of such anisotropy and gives a brief mathematical look into modelling the behaviour.

Brillouin Zones

This teaching and learning package provides an introduction to Brillouin zones in two and three dimensions and is aimed at developing familiarity with Brillouin Zones. It will not cover any specific applications. Brillouin Zones are particularly useful in understanding the electronic and thermal properties of crystalline solids.

Casting

This TLP introduces a number of important processes through which metallic items can be fabricated from molten metal. As well as detailing the practical aspects of these manufacturing processes, attention is given to the important parameters which determine the microstructure of the finished items.

Coating Mechanics

This TLP should provide some insights into the mechanics of bi-layer (coating on substrate) systems. It covers the concept of a misfit strain and the way in which equilibrium is established after its introduction, including the creation of curvature. The differences between "thin" and "thick" coating cases are explained.

Introduction To Deformation Processes

This teaching and learning package covers the fundamentals of metal forming processes.

Dislocation Energetics

This teaching and learning package (TLP) uses an atomistic model of the misfit energy to predict dislocation width and Peierls stress.

Introduction To Dislocations

Dislocations are crucially important in determining the mechanical behaviour of materials. This teaching and learning package provides an introduction to dislocations and their motion through a crystal. A 'bubble raft' model is used to demonstrate some of the features of dislocations and other lattice defects. Some methods for observing real dislocations in materials are examined.

Electromigration

Electromigration is an ever-increasing problem as integrated circuits are pushed towards further miniaturization. The theory of the phenomenon is explained, including electromigration-induced failure and how it has been and can be minimized.

Epitaxial Growth

This TLP enables you to explore the way in which perfect thin crystalline layers are deposited epitaxially (i.e. in the same crystal orientation) on semiconductor substrates. This is the way many electronic and opto-electronic devices are now fabricated using techniques such as molecular beam epitaxy (MBE).

The Jominy End Quench Test

Discusses the aims, method and use of results of a test for the hardenability of steel.

Introduction to Mechanical Properties of Materials

This teaching and learning package (TLP) introduces mechanical properties of materials, starting from a stress–strain curve and exploring both elastic behaviour (e.g., Hooke's law) and plastic behaviour (e.g., slip, creep).

Mechanical Testing of Metals

This teaching and learning package (TLP) introduces the basic mechanics involved in mechanical testing of metals, first outlining the meaning of deviatoric and hydrostatic stresses and strains, followed by definitions of true and nominal values and then covering the idea of constitutive laws that characterise the development of plastic deformation. The issues involved in carrying out conventional uniaxial (tensile and compressive) tests, and interpreting experimental outcomes, are then described. Finally, hardness testing is explained, followed by the development of a related technique involving indentation testing that allows full stress-strain curves to be obtained. All of the analyses are based on a continuum treatment of plastic deformation, with extensive numerical modelling, using the Finite Element Method (FEM).

Mechanisms of Plasticity

This TLP should provide some insights into the plasticity of crystals. It covers some of the important concepts in single-crystals such as Frank-Read source, Lomer locks, climb and cross-slip, and their roles in forest hardening. In addition, grain boundary hardening in poly-crystals is also explained.

Microstructural Examination

This teaching and learning package (TLP) looks at how what we see in micrographs relates to equilibrium phase diagrams and cooling routes for alloy systems.

Physical Vapour Deposition of Thin Films

This TLP aims to look at Physical Vapour Deposition (PVD) as a method to apply thin films. It covers evaporation and sputtering, and then moves on to look at shadowing.

Slip in Single Crystals

This teaching and learning package explains how plastic deformation of materials occurs through the mechanism of slip. Slip involves dislocation glide on particular slip planes. The geometry of slip is explained, and electron microscopy techniques are used to show slip occurring in single crystals of cadmium.

Stress Analysis and Mohr's Circle

This teaching and learning package provides an introduction to the theory of metal forming. It discusses how stress and strain can be presented as tensors, and ways of identifying the principal stresses. Suitable yield criteria to treat metals and non-metals are also presented.

Introduction to thermal and electrical conductivity

This teaching and learning package (TLP) provides an introductory guide to both electrical and thermal conduction. It includes a few of the basic mechanisms of conduction, some useful formulae, and some common applications of electrical and thermal conductors and insulators.

Thermal Expansion and the Bi-material Strip

This teaching and learning package (TLP) is based on lab work in the Department of Materials Science and Metallurgy at the University of Cambridge. The TLP provides an introduction to the topic of thermal expansion, and its application, together with the different stiffness of materials, in the bi-material strip. The TLP leads you through experiments to measure Youngs Modulus from the deflection of a cantilever beam, and to estimate the boiling temperature of nitrogen and the expansivity of a polycarbonate material from the curvature of a bi-material strip immersed in liquid nitrogen.

Toughening of Materials

The purpose of this Teaching and Learning Package is to provide an insight into the methods used to toughen brittle materials.

Tribology - the friction and wear of materials

Consideration of the behaviour of surfaces in contact with one another leads to the subject of tribology ? the study of the friction, lubrication and wear of materials.