Re-use of this resource is governed by a Creative Commons Attribution-
NonCommercial-ShareAlike 4.0 International
https://creativecommons.org/licenses/by-nc-sa/4.0/
creative commons DoITPoMS logo

Predicting the Solidification Behaviour of Lead-Free Solder

axes and labels X Sn at.% Sn 94 96 98 100 2 tie line multiple tie lines Liquid composition moves down eutectic valley enriching in Cu Solid composition moves away from pure Sn enriching in Ag path arrows

The diagram above shows the liquidus projection for the Sn rich corner of the Sn-Ag-Cu system.
The bulk composition of alloy X (3.77 at.% Ag 0.93 at.% Cu balance Sn) is plotted (red circle).