Thermal Expansion and the Bi-material Strip
AimsBefore you startIntroductionExperiment: Measurement of Young's modulusResults: Measurement of Young's modulusSimulation: Measurement of Young's modulusOrigin of thermal expansionThe bi-material stripExperiment: Estimating the boiling temperature of nitrogenResults: Estimating the boiling temperature of nitrogenExperiment: Measuring the thermal expansivity of polycarbonateResults: Measuring the thermal expansivity of polycarbonateSummaryQuestionsGoing furtherTLP creditsTLP contentsShow all contentViewing and downloading resourcesAbout the TLPsTerms of useFeedbackCredits Print this page
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Mechanical and thermal properties of some engineering materials
Material |
Young's
modulus (GPa) |
Density
(Mg m-3) |
Thermal
expansivity (K-1 x 10-6) |
Thermal
conductivity (W m-1 K-1) |
---|---|---|---|---|
Mild Steel |
208
|
7.8
|
15
|
60
|
Aluminium |
70
|
2.8
|
23
|
230
|
Titanium |
115
|
4.5
|
9.5
|
22
|
Copper |
117
|
8.9
|
17
|
390
|
Thermoplastic (e.g. Nylon 6) |
~2
|
1.1
|
~90
|
0.2
|
Thermoset (e.g. Epoxy resin) |
~3
|
1.3
|
~60
|
0.1
|
Alumina |
300
|
3.9
|
8
|
30
|