DoITPoMS

Creep Deformation of Metals

Creep is a major concern in engineering, since it can cause materials to fail well below their yield stress. This package outlines the mechanisms of creep and the associated equations. It is largely based around a first year Materials Science practical at the University of Cambridge, which is concerned with the creep of solder at different temperatures. It also includes a case study of a creep-resistant material to illustrate how materials can be designed to prevent creep.

Photograph of coil undergoing creep

You can also view and download the animations from this TLP at CORE-Materials
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First created: August 2006. Last updated: September 2006