Dissemination of IT for the Promotion of Materials Science (DoITPoMS)

DoITPoMS Teaching & Learning Packages Thermal Expansion and the Bi-material Strip

Thermal Expansion and the Bi-material Strip

This teaching and learning package (TLP) is based on lab work in the Department of Materials Science and Metallurgy at the University of Cambridge. The TLP provides an introduction to the topic of thermal expansion, and its application, together with the different stiffness of materials, in the bi-material strip. The TLP leads you through experiments to measure Young's Modulus from the deflection of a cantilever beam, and to estimate the boiling temperature of nitrogen and the expansivity of a polycarbonate material from the curvature of a bi-material strip immersed in liquid nitrogen.


First created: 2004. Revised: August 2006.