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Full Record for Micrograph 757
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- Micrograph no
- 757
- Brief description
- Bi 50, Sn 50 (wt%)
- Keywords
- alloy
, bismuth, metal, tin - Categories
- Metal or alloy
- System
- Bi-Sn
- Composition
- Bi 50, Sn 50 (wt%)
- Standard codes
- Reaction
- Processing
- Small casting in alumina crucible - air cooled.
- Applications
- Educational alloy - low melting point allows easy and safe use for students.
- Sample preparation
- Standard polishing techniques.
- Technique
- Scanning electron microscopy (SEM) in secondary electron imaging (SEI) mode
- Length bar
- 100 μm
- Further information
- A coarse dendritic structure can be clearly seen.
- Contributor
- M Charles and A Cockburn
- Organisation
- Department of Materials Science and Metallurgy, University of Cambridge
- Date
- 07/05/03
- Licence for re-use
Attribution-Non-Commercial-Share Alike 2.0 UK: England & Wales- Related micrographs
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- Micrograph 745: Bi 10, Sn 90 (wt%) (100 μm)
- Micrograph 746: Bi 10, Sn 90 (wt%) (10 μm)
- Micrograph 747: Bi 20, Sn 80 (wt%) (300 μm)
- Micrograph 748: Bi 20, Sn 80 (wt%) (100 μm)
- Micrograph 749: Bi 20, Sn 80 (wt%) (10 μm)
- Micrograph 750: Bi 30, Sn 70 (wt%) (300 μm)
- Micrograph 751: Bi 30, Sn 70 (wt%) (100 μm)
- Micrograph 752: Bi 30, Sn 70 (wt%) (10 μm)
- Micrograph 753: Bi 40, Sn 60 (wt%) (300 μm)
- Micrograph 754: Bi 40, Sn 60 (wt%) (100 μm)
- Micrograph 755: Bi 40, Sn 60 (wt%) (10 μm)
- Micrograph 756: Bi 50, Sn 50 (wt%) (300 μm)
- Micrograph 758: Bi 50, Sn 50 (wt%) (10 μm)
- Micrograph 759: Bi 60, Sn 40 (wt%) (300 μm)
- Micrograph 760: Bi 60, Sn 40 (wt%) (100 μm)
- Micrograph 761: Bi 60, Sn 40 (wt%) (10 μm)
- Micrograph 762: Bi 70, Sn 30 (wt%) (300 μm)
- Micrograph 763: Bi 70, Sn 30 (wt%) (100 μm)
- Micrograph 764: Bi 70, Sn 30 (wt%) (10 μm)
- Micrograph 765: Bi 80, Sn 20 (wt%) (300 μm)
- Micrograph 766: Bi 80, Sn 20 (wt%) (100 μm)
- Micrograph 767: Bi 80, Sn 20 (wt%) (10 μm)
- Micrograph 768: Bi 90, Sn 10 (wt%) (300 μm)
- Micrograph 769: Bi 90, Sn 10 (wt%) (100 μm)
- Micrograph 770: Bi 90, Sn 10 (wt%) (10 μm)